VLSI Design (VD)
EC-701-
Unit 1Practical Consideration and Technology in VLSI Design
Introduction · Size and complexity of Integrated Circuits · The Microelectronics Field · IC Production Process · Processing Steps · Packaging and Testing · MOS Processes · NMOS Process · CMOS Process · Bipolar Technology · Hybrid Technology · Design Rules and Process Parameters
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Unit 2Device Modeling
Dc Models · Small Signal Models · MOS Models · MOSFET Models in High Frequency and small signal · Short channel devices · Sub threshold Operations · Modeling Noise Sources in MOSFET’s · Diode Models · Bipolar Models · Passive component Models
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Unit 3Circuit Simulation
Introduction · Circuit Simulation Using Spice · MOSFET Model · Level 1 Large signal model · Level 2 Large Signal Model · High Frequency Model · Noise Model of MOSFET · Large signal Diode Current · High Frequency BJT Model · BJT Noise Model · temperature Dependence of BJT
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Unit 4Structured Digital Circuits and Systems
Random Logic and Structured Logic Forms · Register Storage Circuits · Quasi Static Register Cells · A Static Register Cell · Micro coded Controllers · Microprocessor Design · Systolic Arrays · Bit-Serial Processing Elements · Algotronix
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Unit 5CMOS Processing Technology
Basic CMOS Technology · A Basic n-well CMOS Process · Twin Tub Processes · CMOS Process Enhancement · Interconnects and Circuit Elements · Layout Design Rules · Latch up · Physical Origin · Latchup Triggering · Latch up Prevention · Internal Latch up Prevention Techniques