EC-701 · VLSI Design/Official Syllabus
VLSI Design (EC-701) - Official Syllabus
1
Unit 1
Practical Consideration and Technology in VLSI Design
- Introduction
- Size and complexity of Integrated Circuits
- The Microelectronics Field
- IC Production Process
- Processing Steps
- Packaging
- Testing
- MOS Processes
- NMOS Process
- CMOS Process
- Bipolar Technology
- Hybrid Technology
- Design Rules
- Process Parameters
2
Unit 2
Device Modeling
- Dc Models
- Small Signal Models
- MOS Models
- MOSFET Models in High Frequency and small signal
- Short channel devices
- Sub threshold Operations
- Modeling Noise Sources in MOSFETe28099s
- Diode Models
- Bipolar Models
- Passive component Models
3
Unit 3
Circuit Simulation
- Introduction
- Circuit Simulation Using Spice
- MOSFET Model
- Level 1 Large signal model
- Level 2 Large Signal Model
- High Frequency Model
- Noise Model of MOSFET
- Large signal Diode Current
- High Frequency BJT Model
- BJT Noise Model
- temperature Dependence of BJT
4
Unit 4
Structured Digital Circuits and Systems
- Random Logic
- Structured Logic Forms
- Register Storage Circuits
- Quasi Static Register Cells
- A Static Register Cell
- Micro coded Controllers
- Microprocessor Design
- Systolic Arrays
- Bit-Serial Processing Elements
- Algotronix
5
Unit 5
CMOS Processing Technology
- Basic CMOS Technology
- A Basic n-well CMOS Process
- Twin Tub Processes
- CMOS Process Enhancement
- Interconnects
- Circuit Elements
- Layout Design Rules
- Latch up
- Physical Origin
- Latchup Triggering
- Latch up Prevention
- Internal Latch up Prevention Techniques
Reference Books
- VLSI Design Techniques for Analog and Digital Circuits — Geiger, Allen, Strader — TMH
- VLSI Fabrication Principles — Sorab Gandhi — Wiley India
- Principles of CMOS VLSI design — Weste, Eshraghian — Addison-Wesley
- CMOS VLSI Design — Weste, Harris, Banerjee — Pearson-Education
- Basic VLSI Design — Pucknell, Eshraghian — PHI Learning
- Integrated Circuits — Botkar — Khanna Publishers
- VLSI Technology — Sze — TMH
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