UNIT 4: HIGH VOLTAGE ENGINEERING & POWER ELECTRONICS APPLICATIONS TO POWER SYSTEMS
I. HIGH VOLTAGE TECHNOLOGY: FUNDAMENTALS & APPLICATIONS
A. Introduction & Significance
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Definition:
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High Voltage (HV): Typically > 33 kV (for transmission).
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Extra High Voltage (EHV): 220 kV – 400 kV.
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Ultra High Voltage (UHV): > 800 kV (AC) or ±600 kV (DC).
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Significance in Modern Power Systems:
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Enables long-distance power transmission with reduced I²R losses.
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Increases power transfer capability for a given conductor size.
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Essential for bulk power grid interconnections.
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Major Applications:
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Power Applications: HV/EHV/UHV transmission lines, substations, HVDC converter stations, circuit breakers, transformers.
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Non-Power Applications: Industrial (electrostatic precipitators, X-ray generation), medical (radiotherapy, imaging), research (particle accelerators, fusion reactors).
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B. Need for High Voltage Generation in Laboratories
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Primary Purposes:
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Insulation Testing: Routine, type, and acceptance tests on equipment (transformers, cables, insulators).
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Dielectric Breakdown Research: Studying breakdown mechanisms in gases, vacuum, solids, and liquids.
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Calibration: Standardizing high-voltage measuring instruments (meters, dividers).
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Overvoltage Simulation: Generating standard lightning (1.2/50 µs) and switching (250/2500 µs) impulse waves to test equipment immunity.
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Key Testing Scenarios:
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Dielectric Withstand Test: Applied voltage > rated voltage for a specified time.
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Impulse Test: Simulates atmospheric lightning or switching surges.
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II. DIELECTRIC BREAKDOWN PHENOMENA
A. Gaseous Dielectrics
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Ionization Processes:
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Primary Ionization: Free electron gains energy from electric field, collides with neutral molecule → ionization (positive ion + 2 electrons) if energy > ionization potential.
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Secondary Ionization: Positive ion drifts to cathode, emits secondary electrons upon impact (γ process). Also includes photoionization and field emission.
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Townsend's Theory of Breakdown:
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Townsend's First Coefficient (α): Number of ionizing collisions produced by one electron per unit path length (primary process).
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Townsend's Second Coefficient (γ): Number of secondary electrons emitted per positive ion arriving at cathode.
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Breakdown Condition (Townsend Criterion):
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$$ \gamma \left( e^{\alpha d} - 1 \right) = 1 $$
where `d` is gap distance. Breakdown occurs when electron multiplication becomes **self-sustaining**.
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Streamer Mechanism of Breakdown:
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Explains breakdown in non-uniform fields and long gaps where Townsend theory fails.
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Space charge from avalanche distorts local electric field, creating a high-field tip (streamer head) that propagates forward via photoionization.
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Improvement over Townsend: Accounts for rapid, avalanche-to-streamer transition and leader formation in long gaps.
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Statistical and Formative Time Lags:
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Statistical Time Lag (tₛ): Time for initial free electron to appear (random process).
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Formative Time Lag (t_f): Time for electron avalanche to develop to breakdown after the first electron appears.
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Total Breakdown Time Lag (T) = tₛ + t_f.
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B. Paschen's Law
- Statement: Breakdown voltage (
V_b) in a gas is a unique function of the product of gas pressure (p) and electrode gap distance (d).
$$ V_b = f(pd) $$
- Derivation (Simplified): Based on Townsend criterion, assuming α/p = A exp(-Bp/E) (where E = V/d). Leads to:
$$ V_b = \frac{Bpd}{\ln(Apd) - \ln[\ln(1 + 1/\gamma)]} $$
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Paschen Minimum:
V_bhas a minimum at a specific(pd)_min. For air,V_b(min) ≈ 327 Vatpd ≈ 0.567 torr-cm. -
Practical Implications:
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Sets minimum clearance requirements for HV equipment.
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Explains why spark gaps in vacuum or high-pressure gas have different characteristics.
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Guides insulation coordination and gas pressure selection (e.g., in GIS).
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C. Breakdown in Vacuum & Solid Dielectrics
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Breakdown in Deep Vacuum:
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Mechanism not purely electronic. Dominated by:
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Cavity Breakdown: Micro-protrusions on electrodes create localized high fields → field emission → vaporization → arc.
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Surface Flashover: Breakdown along insulator surfaces due to adsorbed gases/desorption.
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Breakdown in Solid Dielectrics:
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Intrinsic Strength: Theoretical breakdown strength due to pure electronic processes (~10⁶ V/cm for good solids).
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Electronic Breakdown Mechanisms:
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Avalanche Breakdown: Similar to gas, but in conduction/valence bands.
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Cumulative Breakdown: Thermal or defect-induced (practical breakdown always lower than intrinsic due to impurities, voids, defects).
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III. HIGH VOLTAGE GENERATION & MEASUREMENT
A. High Voltage Generation
1. AC Generation:
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Testing Transformer: Step-up transformer with insulated core to avoid core saturation. Used for power frequency (50/60 Hz) testing.
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Cascaded Transformers: Multiple transformers in series to achieve very high voltages, with each stage insulated for its own voltage.
2. DC Generation - Cockcroft-Walton (Greinacher) Multiplier:
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Principle: Uses a capacitor-diode ladder to rectify and multiply AC input.
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Operation: Each stage adds peak input voltage (
V_m).nstages →n * V_m(no load). -
Advantages: No moving parts, compact, high output voltage from low input.
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Limitations: High ripple, poor voltage regulation under load, voltage drop increases with stages and current.
Output Voltage (approx.): $$\displaystyle V_{out} \approx 2nV_m - \frac{I_{load}}{fC} \left( \frac{2n^3}{3} + \frac{n^2}{2} + \frac{n}{6} \right) $$
3. Impulse Voltage Generation - Marx Circuit:
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Principle: Capacitors charged in parallel to
Vthen discharged in series to generatenVimpulse. -
Triggering (Three-Electrode Gap):
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Why Preferred: Ensures simultaneous discharge of all stages, minimizing wavefront time jitter.
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Arrangement: Trigger electrode between main gap and hold-off gap. High-voltage pulse on trigger electrode initiates breakdown of all main gaps nearly simultaneously.
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Control Tripping: Triggering pulse applied to trigger electrode to initiate controlled discharge.
4. Tesla Coil (Oscillatory Impulse Generator):
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Construction: HV transformer, capacitor (primary), spark gap, large secondary coil with open core.
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Working: Capacitor charges → spark gap fires → oscillatory discharge in primary induces high voltage in secondary → high-frequency, high-voltage AC output (resonant frequency ~100 kHz - 1 MHz).
5. Series Resonant Circuit for HV Testing:
- Principle: At series resonance (
ωL = 1/ωC), circuit impedance is minimum (pure resistance), current is maximum. Voltage across capacitor (V_C) or inductor (V_L) is Q-times the input voltage (V_in).
$$ \text{Resonance Condition: } \omega_0 L = \frac{1}{\omega_0 C} \quad \text{or} \quad f_0 = \frac{1}{2\pi\sqrt{LC}} $$
$$ \text{Voltage Magnification: } V_C = Q \cdot V_{in}, \quad \text{where } Q = \frac{1}{R} \sqrt{\frac{L}{C}} $$
- Use: Generates high test voltage with low input power from a low-voltage source.
B. High Voltage Measurement
1. General Requirements:
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Impulse: Low inductance, wide bandwidth, capacitive compensation.
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AC/DC: Accuracy, stability, low power loss.
2. Potential Dividers:
| Type | Principle | Advantages | Limitations |
|---|---|---|---|
| Resistance | High-value resistive voltage division | Simple, good for DC/50Hz | High power loss, capacitive effect distorts impulse, limited bandwidth |
| Capacitance | Capacitive voltage division (C₁ >> C₂) | Low loss, excellent for impulse | Requires guarding, sensitive to stray capacitance |
| Mixed RC | Series RC (R₁C₁) // (R₂C₂) | Good for both AC & impulse, compensates capacitance | More complex design, needs precise matching |
3. Sphere Gap:
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Principle: Breakdown voltage between two spheres is a function of diameter (D) and gap (g). Well-established by standards (IEC 60052).
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Measurement: Measures peak value of AC, DC, and impulse voltages. Polarity and wavefront time affect reading.
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Influencing Factors:
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Sphere diameter
D -
Gap spacing
g -
Atmospheric conditions (pressure, temperature, humidity) → correction factor.
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Polarity (for DC/impulse).
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Wavefront time (for impulse).
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4. Generating Voltmeter (for High DC):
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Principle: Rotating vane (or disc) in electric field experiences torque proportional to
V². Rotation speed measured optically → calibrated to voltage. -
Construction: Motor-driven rotor inside shielded high-voltage electrode.
5. Electrostatic Voltmeter:
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Principle: Fixed electrode and movable vane/plate. Attraction force
F ∝ V². Deflection measured by pointer/mirror. -
Use: Accurate for AC and DC up to several hundred kV. High input impedance.
6. Surge Current Measurement:
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Challenges: Extremely high
di/dt(kA/µs), magnetic saturation, bandwidth > 10 MHz. -
Methods:
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Rogowski Coil: Air-cored toroidal coil around conductor. Output
V_out ∝ di/dt. Integrates to geti(t). No saturation, high bandwidth. -
Low-Value Shunt Resistor:
V_shunt = i * R_shunt. Must be non-inductive, low inductance (< 10 nH), high bandwidth.
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IV. HIGH VOLTAGE TESTING OF EQUIPMENT & MATERIALS
| Equipment/Component | Key Tests | Objectives |
|---|---|---|
| Insulators | 1. Flash-over Voltage Test<br>2. Mechanical Strength Test<br>3. Puncture Voltage Test | 1. Determine dry/wet flashover voltage.<br>2. Verify mechanical load withstand (tension, compression).<br>3. Check internal dielectric strength (avoid puncture). |
| Circuit Breakers | 1. Short-Circuit Test<br>2. Dielectric Test | 1. Test making/breaking capacity under fault conditions.<br>2. Verify insulation withstand (power frequency & impulse). |
| High-Voltage Cables | Partial Discharge (PD) Tests | 1. Detect localized insulation defects (voids, cracks).<br>2. Locate faults using time-domain reflectometry (TDR) on PD pulse arrival times. |
| Power Transformers | High Voltage (Dielectric Withstand) Test | Apply high voltage (AC or impulse) between windings and ground/other windings to prove insulation integrity. ≠ Insulation Resistance Test (megger test, low voltage, measures absorption/resistivity). |
| Insulating Materials | Intrinsic Strength Test, Impregnation Tests | 1. Compare intrinsic vs. practical breakdown strength.<br>2. Impregnation/Varnishing: Pouring methods (e.g., dip-and-bake, vacuum-pressure) to eliminate voids and improve dielectric strength. |
V. POWER ELECTRONICS APPLICATIONS TO POWER SYSTEMS (HVDC & FACTS)
A. High Voltage DC (HVDC) Transmission
1. Fundamentals:
| Merits of HVDC | Demerits of HVDC |
|---|---|
| • Asynchronous interconnection (no sync issues).<br>• Lower line cost for long distances (>~600 km) or underwater cables.<br>• Controllable power flow (independent of phase angle).<br>• No skin effect, lower losses.<br>• Stability improvement (no reactive power support needed from AC system). | • High converter station cost (converters, filters).<br>• Complex control and harmonics generation.<br>• Need for reactive power at converter stations.<br>• Limited multiterminal operation complexity.<br>• No overload capability like AC lines. |
2. HVDC Converter Station Layout & Equipment:
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Converters: Line-Commutated Converters (LCC - thyristor valves) or Voltage-Source Converters (VSC - IGBTs).
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AC Filters: Tuned to 5th, 7th, 11th, 13th harmonics + high-pass for RF noise.
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DC Filters: For commutating harmonics on DC side.
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Smoothing Reactor: Limits ripple current in DC line.
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DC Capacitors: For VSC-HVDC, filter DC ripple.
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Surge Arresters: Protect against overvoltages.
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Control System: Firing angle/phase control, current/voltage regulation.
3. HVDC System Control:
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Principle: Master controller sets power/current order. Converters control current (to avoid commutation failure) or extinction angle (γ) (for LCC).
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Converter Control Characteristics:
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Rectifier: Constant Current Control (CCC) or Constant Extinction Angle (CEA).
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Inverter: Constant Current Control (CCC) or Constant Gamma Control (CGC).
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System Characteristic: Rectifier current order vs. voltage; Inverter current order vs. extinction angle. Intersection determines operating point.
Power Reversal: Achieved by reversing current direction (change polarity of DC voltage or current order sign). For LCC, requires firing angle > 90° on one end.
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4. Harmonics in HVDC:
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Characteristic Harmonics:
h = p(k) ± 1(for 12-pulse: 11, 13, 23, 25...). Generated by converter switching. -
Non-Characteristic Harmonics: Due to unbalance, firing angle errors, transformer saturation (e.g., 3rd, 5th, 7th).
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Sources: Converter valves, transformer magnetizing current.
5. Multi-Terminal DC (MTDC) Systems:
| Type | Configuration | Comparison | Applications |
|---|---|---|---|
| Series MTDC | Terminals connected in series on DC line. | • Current common → power control by voltage.<br>• Complex control, one terminal failure affects all.<br>• No need for DC circuit breakers. | Few, mainly research (e.g., early schemes). |
| Parallel MTDC | Terminals connected in parallel to DC bus. | • Voltage common → power control by current.<br>• Independent control possible.<br>• Requires DC breakers for isolation.<br>• More flexible, reliable. | HVDC grids, offshore wind farms, multi-infeed systems. |
6. Types of DC Links:
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Point-to-Point: Two converter stations.
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Back-to-Back: No DC line; converters in same station (asynchronous tie).
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Multi-Terminal: >2 converter stations (parallel or series).
B. Flexible AC Transmission Systems (FACTS)
1. Introduction: Power electronics-based controllers that enhance controllability and increase power transfer capability of AC networks by dynamically controlling voltage, impedance, phase angle.
2. Conventional Reactive Power Compensators:
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Shunt Compensation: Capacitors/inductors in parallel → control voltage/power factor.
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Series Compensation: Capacitor in series → reduce line impedance, increase power transfer.
3. Major FACTS Devices:
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Static VAR Compensator (SVC):
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Principle: Combination of Thyristor-Controlled Reactor (TCR) and Thyristor-Switched Capacitor (TSC) or Fixed Capacitor (FC).
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Operation: TCR provides continuous reactive absorption (by phase-angle control), TSC/FC provides stepwise capacitive injection. Net continuous VAR control.
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Response: Fast (~few cycles).
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Static Synchronous Compensator (STATCOM):
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Principle: Voltage-Source Converter (VSC) with DC capacitor, connected in shunt via transformer.
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Operation: Outputs a synchronous voltage (
V_s) whose magnitude and phase relative to AC system voltage (V_sys) control reactive power flow.-
|V_s| > |V_sys|→ capacitive (inject Q). -
|V_s| < |V_sys|→ inductive (absorb Q).
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Advantages over SVC: Better voltage support at low voltages, smaller footprint, faster response, less harmonics.
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Thyristor-Controlled Series Capacitor (TCSC):
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Construction: Series capacitor (
X_C) bypassed by a Thyristor-Controlled Reactor (TCR). -
Working/Operation:
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Impedance Modulation: By controlling TCR firing angle (α), the net series reactance (
X_net = X_C - X_L(α)) can be varied continuously betweenX_C(fully ON) andX_C - X_L(fully OFF). -
Modes: Blocking (high impedance), Bypass (low impedance, for protection/SSSC operation), Control (variable impedance).
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Advantages: Damping of power oscillations, increased transfer capability, flexible power flow control.
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Disadvantages: Complex control, potential for subsynchronous resonance (SSR) if not properly coordinated.
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Static Synchronous Series Compensator (SSSC):
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Principle: VSC with DC capacitor, connected in series via transformer.
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Operation: Injects a controllable AC voltage (
V_s) in quadrature with line current (I_line). Acts as a variable series impedance (V_s / I_line). -
Use: Power flow control (increase/reverse), damping oscillations, loop flow management.
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Unified Power Flow Controller (UPFC):
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Schematic: Combines STATCOM (shunt) and SSSC (series) via common DC link.
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Basic Concept: Shunt converter supplies/absorbs active power to/from DC link to support series converter's voltage injection. Provides independent control of:
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Bus voltage (shunt).
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Line impedance/voltage (series).
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Power flow (combined effect).
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Most versatile FACTS device.
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