Skip to content
EX-604 (B) · Internet of Things (IOT)/Quick Revision Short Notes

Internet of Things (IOT) (EX-604 (B)) - Unit 1 Short Notes

UNIT 1: ELECTRONIC INSTRUMENTATION - SHORT NOTES


I. CATHODE RAY OSCILLOSCOPE (CRO) & CRT FUNDAMENTALS

A. CRT Construction & Electrostatic Deflection

  • Construction: Consists of an electron gun (cathode, control grid, focusing & accelerating anodes), deflection system (electrostatic plates), phosphor screen (fluorescent screen), and a glass envelope (evacuated).

  • Electrostatic Deflection: Deflection of the electron beam by applying a voltage across a pair of parallel plates. The force on an electron is $$\displaystyle F = eE = e \frac{V_d}{d} $$, where $$\displaystyle V_d $$ is deflecting voltage and $d$ is plate separation.

  • Deflection Sensitivity (S): Deflection on screen (mm or cm) per unit deflecting voltage.

$$S = \frac{D}{V_d} \quad \text{(mm/V)}$$

  • Deflection Factor (D_f): Reciprocal of sensitivity. Deflecting voltage required for unit deflection.

$$D_f = \frac{1}{S} = \frac{V_d}{D} \quad \text{(V/mm)}$$

  • Post-Deflection Acceleration (PDA): An additional high-voltage anode placed after the deflection plates.

    • Purpose: Increases the velocity of the electron beam after deflection.

    • Effect: Reduces the spot size (less time for beam spreading) and increases brightness. It does not affect the deflection sensitivity $S$ (since deflection occurs before acceleration), but the deflection factor $$\displaystyle D_f $$ becomes larger.

[!TIP] Common Pitfall: Students often confuse the effect of PDA on sensitivity. Remember: Deflection happens before PDA, so sensitivity (D/V_d) remains unchanged. Only spot size and brightness improve.

B. CRO Block Diagram & General Purpose CRO

  • Functional Blocks:

    1. Vertical Amplifier: Amplifies the input signal.

    2. Horizontal Amplifier (Time Base): Generates a linearly increasing sweep voltage.

    3. Trigger Circuit: Synchronizes the sweep with the input signal for a stable display.

    4. Power Supply: Provides high voltage for CRT and low voltages for circuits.

    5. CRT: The display device.

  • Applications: Voltage/time measurement, frequency measurement (Lissajous), phase difference measurement, waveform observation, testing digital circuits.

C. Types of Oscilloscopes

Feature Dual-Beam CRO Dual-Trace CRO
Electron Guns Two separate, independent guns. Single gun.
Deflection Two independent sets of plates. One set of plates, signal multiplexed.
Simultaneity Can display two truly simultaneous waveforms. Cannot display two simultaneous events (due to time-sharing).
Modes N/A Chopping (fast switching, good for low freq), Alternate (sequential sweeps, good for high freq).
Cost/Complexity Higher. Lower.
  • Sampling Oscilloscope:

    • Principle: For very high frequencies (> 100 MHz). Takes samples of the input waveform over many cycles and reconstructs the waveform (Equivalent-time sampling).

    • Types: Real-time (for repetitive signals), Equivalent-time (for very high freq).

    • Precaution: Cannot display non-repetitive or one-shot signals.

  • Wobbly Scope (Sweep Generator): A CRO where the horizontal sweep is externally controlled by a low-frequency signal. Used to display frequency response (magnitude vs. frequency) of a circuit on the screen (X: freq, Y: output amplitude).

D. Time Base Circuits & Sweep Generation

  • Sawtooth Wave Generation: Circuits like Miller (bootstrap) integrator and Phantastron are used.

  • Sweep Synchronization (Triggering): The process of starting the sweep voltage at a specific point on the input waveform.

    • Effect on Accuracy: Proper synchronization (triggering) ensures a stationary, stable waveform display. Without it, the waveform drifts or rolls, making measurement impossible.

E. Graticules & Lissajous Patterns

  • Graticules: Grids on the CRT face for measurement. Types: Internal (etched on glass), External (removable plastic), Illuminated (edge-lit).

  • Lissajous Patterns: Formed when two sinusoidal signals are applied to X and Y plates.

    • Frequency Ratio: $$\displaystyle \frac{f_x}{f_y} = \frac{N_x}{N_y} $$, where $$\displaystyle N_x $$ = number of horizontal tangencies, $$\displaystyle N_y $$ = number of vertical tangencies.

    • Phase Measurement: Shape of the ellipse gives phase difference $\phi$ (for equal frequencies).

$$\sin \phi = \frac{B}{A} \quad \text{or} \quad \cos \phi = \frac{C}{A}$$

    (Where A = major axis, B = minor axis, C = intercept on Y-axis).

F. X-Y Recorders & Display Comparisons

  • Analog XY Recorder: Uses two servo-controlled D'Arsonval movements (one for X, one for Y) to plot Y vs X. Slow, mechanical wear.

  • Digital XY Recorder: Uses A/D converters and digital plotter/display. Faster, no wear, can store/print.

  • Electrophoretic Image Display: Used in medical imaging (ECG, EEG). Paper moves under a row of electrodes; ion migration creates visible image.

  • Liquid Vapor Display (LVD): Uses heated filaments to vaporize a colored dye onto paper. Obsolete, replaced by thermal printers.


II. AC BRIDGE CIRCUITS FOR PARAMETER MEASUREMENT

A. General Bridge Theory & Errors

  • Balance Condition (General): For a four-arm bridge (Z₁, Z₂, Z₃, Z₄), balance occurs when:

$$Z_1 Z_4 = Z_2 Z_3$$

In terms of impedances (R ± jX) or admittances (G ± jB).
  • Sources of Errors & Reduction:

    • Contact Resistance & Thermal EMF: Use four-terminal connections, AC excitation, copper bars.

    • Stray Capacitance: Shielding, guarding, using Wagner earth.

    • Frequency: Use appropriate bridge for frequency, or operate at standard frequency (1 kHz).

    • Temperature: Temperature-controlled environment, temperature compensation.

  • Detectors: Vibration Galvanometer (for power freq), Headphones (audio freq), CRO (wide freq), Tuned Amplifier (high sensitivity at specific freq).

B. Specific Bridges

Bridge Measures Key Feature / Balance Equation
Wheatstone Medium Resistance (1 Ω - 1 MΩ) $$\displaystyle R_x = \frac{R_2}{R_1} R_3 $$ (simple ratio)
Kelvin (Thomson) Low Resistance (< 1 Ω) Eliminates lead/contact resistance using four terminals. $$\displaystyle R_x = \frac{R_2}{R_1} R_3 $$ (with ratio arms R₁, R₂ and standard R₃).
Megger High Insulation Resistance (> 1 MΩ) Uses hand-cranked or battery-powered high-voltage (500V, 1kV) source.
De Sauty's Compare two Capacitances Simple, but assumes lossless capacitors. Balance: $$\displaystyle C_1/C_2 = R_2/R_1 $$. Not suitable for lossy capacitors.
Schering Capacitance & Dissipation Factor (tan δ) High-Voltage Schering Bridge used for testing insulators/cables. Balance: $$\displaystyle C_x = C_2 \frac{R_1}{R_2} $$, $$\displaystyle \tan \delta = \omega C_2 R_1 $$.
Wien Bridge Frequency / Capacitance For freq: $$\displaystyle f = \frac{1}{2\pi R_1 R_2 C_1 C_2} $$ (if R₁=R₂, C₁=C₂). For C: $$\displaystyle C_x = C_1 \frac{R_4}{R_3} $$ at known freq.
Maxwell Inductance (moderate Q, 1<Q<10) $$\displaystyle L_x = R_2 R_3 C_1 $$, $$\displaystyle R_x = \frac{R_2 R_3}{R_1} $$. Demerit: Standard capacitor must be loss-free.
Hay's Inductance (high Q) Modification of Maxwell. Adds a choke in series with C₁. Suitable for Q > 10.
Anderson Precise Inductance More complex (5 arms). Uses a fixed capacitor and a variable resistor. More accurate than Maxwell for a wide Q range.
Owen Iron-cored Coil Inductance Uses a fixed capacitor in both ratio arms. Suitable for coils with magnetic cores.
Q-Meter Q-factor & Inductance Series resonant circuit. $$\displaystyle Q = \frac{1}{R} \sqrt{\frac{L}{C}} $$ at resonance. Inductance $$\displaystyle L = \frac{1}{(2\pi f)^2 C} $$.

[!TIP] Exam Focus: Be prepared to derive balance equations for Maxwell, Schering, and Wien bridges. Also, know which bridge is used for loss tangent (Schering) vs high Q inductance (Hay's).

C. Bridge Applications & Problem Solving

  • Loss Factor & Q-Factor Relation: For a capacitor, $$\displaystyle \tan \delta = \frac{1}{Q} $$. For an inductor, $$\displaystyle Q = \frac{\omega L}{R} $$.

  • Example (Maxwell Bridge): Given $$\displaystyle C_1=0.01\mu F $$, $$\displaystyle R_1=470k\Omega $$, $$\displaystyle R_2=5.1k\Omega $$, $$\displaystyle R_3=100k\Omega $$:

$$L_x = R_2 R_3 C_1 = (5.1 \times 10^3)(100 \times 10^3)(0.01 \times 10^{-6}) = 5.1 \ \text{H}$$

$$R_x = \frac{R_2 R_3}{R_1} = \frac{5.1 \times 100}{470} \approx 1.085 \ \text{k}\Omega$$

\boxed{Z_x = 1.085 \ \text{k}\Omega + j 2\pi f \cdot 5.1 \ \text{H}}

III. TRANSDUCERS & SENSORS

A. Fundamental Concepts

  • Transducer: A device that converts a physical quantity (input) into another (usually electrical) output.

  • Primary Transducer: Senses the input and produces a mechanical output (e.g., Bourdon tube in pressure gauge).

  • Secondary Transducer: Converts the mechanical output into an electrical signal (e.g., LVDT attached to Bourdon tube).

  • Digital Multiplexing: Connecting multiple sensors to a single ADC/data logger via a multiplexer (MUX). Improves efficiency by reducing wiring cost, signal conditioning channels, and data acquisition hardware in industrial systems.

B. Resistive Transducers

  • Strain Gauge:

    • Principle: Piezoresistive effect – resistance changes with strain ($$\displaystyle \Delta R / R = GF \cdot \varepsilon $$).

    • Gauge Factor (GF):

$$GF = \frac{\Delta R / R}{\varepsilon} = 1 + 2\nu + \frac{\Delta \rho / \rho}{\varepsilon}$$

    For metals: $GF \approx 2$ (mainly from geometry term $1+2\nu$). For semiconductors: $GF \approx 50-150$ (dominant $\Delta \rho/\rho$ term).

*   **Types:** Metal foil (most common), wire-wound, semiconductor (higher sensitivity, more temperature-sensitive).

*   **Temperature Compensation:** Use **dummy gauge** in adjacent arm of bridge, or use **three-wire/ four-wire** connection to eliminate lead resistance.
  • RTD (Resistance Temperature Detector): Pure metals (Pt, Ni, Cu). Positive TCR. PT100 (100Ω at 0°C). Linear over narrow range, stable, used for -200°C to 850°C.

  • Thermistor: Semiconductors (metal oxides). NTC (most common, resistance ↓ with temp), PTC (resistance ↑ sharply at Curie point). Highly non-linear, high sensitivity, used for -50°C to 150°C.

C. Capacitive Transducers

  • Principle: $$\displaystyle C = \frac{\varepsilon A}{d} $$. Change in Area (A), Distance (d), or Dielectric (ε).

  • Applications: Displacement (parallel plate, change in d), pressure (diaphragm), humidity (change in ε).

D. Inductive Transducers

  • LVDT (Linear Variable Differential Transformer):

    • Construction: One primary winding, two identical secondary windings (series/parallel opposing), movable ferromagnetic core.

    • Working: AC excitation in primary. Core displacement changes mutual inductance, producing differential output voltage $$\displaystyle e_{out} = e_{s1} - e_{s2} $$.

      • Null Position: Core centered → $$\displaystyle e_{s1} = e_{s2} $$ → $$\displaystyle e_{out}=0 $$.

      • Displacement: Core moves → $$\displaystyle e_{out} \neq 0 $$. Amplitude ∝ displacement, phase indicates direction (±90° or ±180° shift).

    • Characteristics: Excellent linearity (~±1% over ±1 inch), infinite resolution, no physical contact (wear-free).

    • Advantages: High reliability, long life, frictionless.

    • Limitations: Large size for long travel, needs AC excitation & demodulation.

  • RVDT (Rotary LVDT): For angular displacement.

E. Piezoelectric Transducers

  • Piezoelectric Effect: Certain crystals (Quartz, Rochelle salt, PZT) generate charge on surfaces when mechanically stressed (direct effect). Conversely, they strain when voltage applied (converse effect).

  • Modes of Operation:

    • Thickness/Extensional: Force applied parallel to polar axis (charge on faces).

    • Transverse: Force applied perpendicular to polar axis (charge on sides).

    • Shear: Shear stress applied.

  • Equivalent Circuit: Voltage source $$\displaystyle V_p = \frac{F}{C_e \cdot S} $$ in series with capacitor $$\displaystyle C_e $$ (crystal capacitance), or charge source $$\displaystyle Q_p = d \cdot F $$ in parallel with $$\displaystyle C_e $$.

  • Applications: Force, pressure, acceleration (seismic mass), ultrasonic generation/detection.

  • Calculation (Example): Given crystal dimensions, charge sensitivity $d$ (C/N), strain $\varepsilon$:

$$F = Y \cdot A \cdot \varepsilon \quad (Y = \text{Young's modulus})$$

$$Q = d \cdot F$$

$$V = \frac{Q}{C} = \frac{Q}{\varepsilon_r \varepsilon_0 A / t} \quad (t = thickness)$$

F. Magnetic Transducers

  • Hall Effect Transducer:

    • Hall Voltage: When current $I$ flows through a conductor/semiconductor in a perpendicular magnetic field $B$, a transverse voltage $$\displaystyle V_H $$ develops.

$$V_H = \frac{R_H I B}{t} = \frac{IB}{n e t}$$

    Where $$\displaystyle R_H = 1/(ne) $$ is Hall coefficient, $t$ is thickness, $n$ is carrier density.

*   **Geometrical Correction Factor (k):** For rectangular samples, $$\displaystyle V_H = k \frac{IB}{nt} $$. $k$ depends on aspect ratio (width/length).

*   **Applications:** Magnetic field measurement, current sensing (clamp meters), position/speed sensing (magnetic encoder).

G. Thermal Transducers

  • Thermocouple:

    • Seebeck Effect: When two dissimilar metals are joined at two junctions at different temperatures, an EMF is generated proportional to the temperature difference.

    • Materials: Reference junction (constant, e.g., Cu-Constantan), measuring junction (chosen for high Seebeck coefficient, e.g., Chromel-Alumel - Type K).

    • Cold Junction Compensation (CJC): Since output depends on difference between measuring and reference junctions, the reference junction must be kept at known temperature (ice bath at 0°C) or its temperature measured and compensated electronically.

  • Thermopile: Series/parallel connection of multiple thermocouples for higher output.

  • Radiation Thermometer (Pyrometer): Measures temperature from emitted infrared radiation (non-contact).

H. Photoelectric Transducers

Type Principle I-V Characteristic Suitability for Low Light
Photovoltaic (Solar Cell) Photon → electron-hole pair → voltage. Short-circuit current $$\displaystyle I_{sc} $$ ∝ light, open-circuit voltage $$\displaystyle V_{oc} $$ ∝ log(light). Moderate. Generates voltage without bias.
Photoconductive (LDR) Light ↓ resistance (cadmium sulfide). Non-linear R vs. light. Poor (slow response, high dark resistance).
Photodiode Reverse-biased pn junction. Photocurrent $$\displaystyle I_{ph} $$ ∝ light. Very linear $$\displaystyle I_{ph} $$ vs. light. Dark current very low. Best. Avalanche Photodiode (APD) provides internal gain for very low light.

I. Other Special Transducers

  • Digital Tachometer:

    • Optical Encoder: Rotating disk with slots; photodiode/phototransistor detects pulses. Frequency $$\displaystyle f = N \cdot RPM / 60 $$.

    • Magnetic Encoder: Uses Hall effect or variable reluctance.

    • Stroboscopic: Flashing light at known frequency; when flash rate matches rotation, image appears stationary.

  • Temperature Transducers by Range:

    • -200°C to 0°C: Platinum RTD, Thermocouple (Type T, E).

    • 0°C to 500°C: Platinum RTD (PT100), Thermocouple (Type J, K, T).

    • 500°C to 1500°C: Thermocouples (Type K, S, R, B).

    • >1500°C: Optical pyrometers.


IV. SIGNAL GENERATORS & WAVE ANALYZERS

A. Function Generators (AF & RF)

  • Block Diagram: Function Generator (produces sine, square, triangle) → Attenuator → Output Amplifier.

  • Sine Wave Generation: RC Wien Bridge Oscillator (uses frequency-selective positive feedback). Frequency $$\displaystyle f = \frac{1}{2\pi RC} $$.

  • Square/Triangle Generation: Comparator/Schmitt Trigger (square from sine) → Integrator (triangle from square).

  • Frequency Control: VCO (Voltage-Controlled Oscillator). External voltage changes the capacitance (varactor) or resistance in the oscillator, thus changing frequency.

  • Beat Frequency Oscillator (BFO): Two close-frequency oscillators (one fixed, one variable). Their outputs are mixed, producing beat frequency $$\displaystyle f_{beat} = |f_1 - f_2| $$. Used for audio-frequency generation (1-20 kHz) with good stability.

B. Sweep & Fixed-Frequency Generators

  • Fixed-Frequency: Outputs a single, precise frequency (e.g., crystal oscillator).

  • Sweep-Frequency (Wobbler): Output frequency varies continuously and repetitively over a range (e.g., 10 Hz - 100 kHz). Used to drive the horizontal input of an oscilloscope in X-Y mode to plot frequency response (Bode plot) of a DUT.

C. Wave Analyzers

  • Frequency Selective (Filter) Type:

    • Principle: Series of tuned filters (LC or RC) to select a narrow frequency band.

    • Limitations: Poor selectivity at high frequencies, limited sensitivity.

  • Heterodyne (Superheterodyne) Type:

    • Principle: 1. Mix input signal with local oscillator (LO) → produces sum & difference frequencies. 2. IF amplifier (high-Q, fixed center frequency, e.g., 455 kHz) selects one (usually difference). 3. Detector extracts amplitude.

    • Advantages: High sensitivity (due to high-gain IF amp) and high selectivity (due to narrow IF filter). Used for RF signal analysis.

  • Spectrum Analyzer:

    • Swept-Tuned: Most common. LO sweeps, mixer produces IF, IF filter selects, detector displays amplitude vs frequency.

    • FFT (Fast Fourier Transform): Digitizes time-domain signal, computes FFT to get frequency spectrum. Faster for transient signals.

[!TIP] Key Difference: Heterodyne wave analyzer uses frequency conversion (mixing) to a fixed IF for better performance at RF. Filter-type directly filters the input, limited to audio frequencies.


V. DIGITAL INSTRUMENTS & METERS

A. Digital Voltmeter (DVM) Types

  • Ramp Type (Integrating - Dual-Slope):

    • Principle: 1. Integrate input voltage $$\displaystyle V_x $$ for fixed time $$\displaystyle T_1 $$ → capacitor voltage ∝ $$\displaystyle V_x $$. 2. De-integrate with reference voltage $$\displaystyle -V_{ref} $$ until capacitor returns to zero → time $$\displaystyle T_2 $$ ∝ $$\displaystyle V_x $$. Count $$\displaystyle T_2 $$.

    • Output: $$\displaystyle V_x = V_{ref} \cdot (T_2 / T_1) $$.

    • Advantages: Excellent noise rejection (integration averages), high accuracy, no need for precision components.

    • Disadvantages: Slow (conversion time ~ T₁+T₂).

  • Successive Approximation Type:

    • Principle: Uses a Successive Approximation Register (SAR) and a DAC. SAR tries bits from MSB to LSB, DAC generates trial voltage, comparator decides bit value.

    • Speed: Fast (conversion in n clock cycles, e.g., 1 µs).

    • Accuracy: Good, but depends on DAC linearity.

  • DVM Specifications (3½ Digit):

    • Resolution: Smallest change detectable. For a 10V range: $$\displaystyle 1 \text{ count} = \frac{10V}{1999} \approx 5 \text{mV} $$. Resolution = 10 mV / 1999 ≈ 0.5 mV.

    • Display Examples:

      • 11.52V on 10V range → Overrange (display shows "1" or "OL").

      • 0.5234V on 1V range → 0.5234 V (full 4 digits used).

      • 0.5234V on 10V range → 0.523 V (only 3 decimal places, leading zero suppressed).

B. Digital Frequency Meter

  • Block Diagram: Input Conditioner (amplifier, Schmitt trigger) → Gate (controlled by time base) → Counter (counts input pulses) → Latch & Display.

  • Working: Gate opens for a precise time interval $T$ (e.g., 1 second from crystal clock). Number of input cycles $N$ counted. Frequency $$\displaystyle f = N / T $$.

C. Digital pH Meter

  • Principle: Glass electrode develops a voltage proportional to pH (Nernst equation: $$\displaystyle E = E_0 - \frac{2.303 RT}{F} pH $$). This high-impedance signal (MΩ) is fed to a high-input-impedance amplifier (FET input op-amp) and then to an ADC/display.

  • Block Diagram: pH Electrode → High-Z Amplifier → ADC → Digital Display. Includes temperature compensation circuit.

D. Data Logger vs Data Acquisition System (DAS)

Feature Data Logger Data Acquisition System (DAS)
Primary Function Record/store data over time (often standalone, battery-powered). Acquire, process, display, control in real-time.
Speed Generally slower (scan rates seconds/minutes). Faster (scan rates kHz or more).
Processing Minimal (just timestamping). Extensive (scaling, engineering units, alarms, control loops).
Connectivity Often USB/Serial for download. Real-time interface to PC/PLC (USB, Ethernet, GPIB).
Use Case Long-term monitoring (temperature, humidity in warehouses). Real-time test, measurement, control (lab, industrial automation).

VI. DISPLAY DEVICES & RECORDERS

A. Display Devices

  • LED (Light Emitting Diode):

    • Principle: Electroluminescence – recombination of electrons/holes in semiconductor (GaAs, GaP) emits light.

    • Advantages: High brightness, fast response time (ns), wide viewing angle.

    • Disadvantages: Higher power consumption, cost per digit higher than LCD.

  • LCD (Liquid Crystal Display - Twisted Nematic):

    • Theory: Liquid crystals between polarizers. Twisted (90°) in OFF state, blocks light. Untwisted by applied voltage, allows light through.

    • Advantages: Very low power (microwatts), flat, cheap.

    • Disadvantages: Slow response time (ms), poor viewing angle, needs backlight (for transmissive type).

  • Comparison:

    • Choose LED for high brightness, outdoor, fast updates.

    • Choose LCD for battery-powered, low-cost, static displays (calculators, meters).

B. Recorders

  • X-Y Recorder:

    • Working: Two independent servo systems (each with amplifier, motor, position feedback) control the X and Y positions of a pen on paper. Input voltages control the setpoints.

    • Applications: Plotting characteristics (I-V, transfer function), Lissajous patterns, process variables.

  • Analog vs Digital Recorders:

    • Analog (Chart Recorder): Pen on paper, mechanical/thermal. Continuous trace, no storage, wear & tear.

    • Digital: Data stored in memory, can be printed/plotted later. No mechanical wear, can store large amounts.


VII. INTERFACING & COMMUNICATION IN INSTRUMENTATION

A. Standard Instrumentation Buses & Interfaces

Interface Type Speed Distance Topology Key Feature
RS-232C Serial Low (~115 kbps) Short (~15 m) Point-to-Point Simple, 3-wire (Tx, Rx, GND), no multi-drop.
IEEE-488 (GPIB) Parallel Medium (~1 Mbps) Medium (~20 m) Multi-drop (up to 15 devices) Talker/Listener/Controller hierarchy. Excellent for multi-instrument systems.
USB Serial High (USB 2.0: 480 Mbps, 3.0: 5 Gbps) Short (~5 m) Star (via hub) Plug-and-play, hot-swap, power over bus.
Ethernet (LXI) Serial Very High (100 Mbps - 10 Gbps) Long (100 m+) Star/Bus Long distance, networkable, LXI standard for instruments.

B. Grounding & Safety

  • Wagener's Earthing Device:

    • Purpose: To safely discharge the high voltage (HV) anode of a CRT (CRO) when the instrument is switched off or during maintenance.

    • Principle: A bleeder resistor (high value, e.g., 1 MΩ) is permanently connected between the HV terminal and earth. Additionally, a manual discharge probe (with high-value resistor) is provided for immediate safe discharge.


VIII. SPECIALIZED TOPICS (SHORT NOTES)

A. Q-Meter

  • Circuit: Series resonant circuit: Unknown coil (L_x, R_x) in series with a standard capacitor (C_s) and a low-loss coil (L_s) with very low resistance. A variac controls the voltage across the circuit. A voltmeter (V) across C_s measures voltage.

  • Working: At resonance ($$\displaystyle \omega L_x = 1/(\omega C_s) $$), impedance is minimum ($$\displaystyle R_x + R_s $$), current maximum, voltage across C_s is $Q$ times the input voltage.

$$Q = \frac{V}{V_{in}} \quad \text{(at resonance)}$$

$$L_x = \frac{1}{\omega^2 C_s} \quad \text{(if } R_s \ll R_x\text{)}$$

  • Application: Direct reading of Q-factor and inductance of coils at a specific frequency.

B. Total Harmonic Distortion (THD)

  • Definition: Measure of harmonic distortion in a signal. Ratio of the RMS value of all harmonic components to the RMS value of the fundamental component.

$$THD = \frac{\sqrt{V_2^2 + V_3^2 + V_4^2 + \dots}}{V_1} \times 100\%$$

Where $$\displaystyle V_1 $$ is fundamental RMS, $$\displaystyle V_2, V_3... $$ are harmonic RMS voltages.
  • Measurement: Using a wave analyzer (heterodyne type) to isolate and measure the fundamental and each harmonic individually, then computing THD.

C. Multi-Input Sampling Oscilloscope

  • Principle: Extension of sampling oscilloscope. Uses multiple sampling channels (e.g., 4 or 8) to capture different points of a repetitive waveform simultaneously (in one cycle) or across multiple cycles.

  • Advantage: Can reconstruct high-speed waveforms with multiple channels (e.g., digital buses) where a single-channel sampler would miss timing relationships.

D. Heterodyne Wave Analyzer (Detailed)

  • Operation: 1. Input signal → Attenuator. 2. Mixed with tunable local oscillator (LO) in ** mixer**. 3. IF amplifier (high-Q, fixed center freq, e.g., 455 kHz) selects difference frequency ($$\displaystyle f_{signal} - f_{LO} $$). 4. Detector (diode) → Low-pass filter → Meter/Display.

  • Tuning: Vary $$\displaystyle f_{LO} $$ so that $$\displaystyle f_{signal} - f_{LO} = f_{IF} $$ (constant). Meter reading s to amplitude of $$\displaystyle f_{signal} $$.

  • Sensitivity & Selectivity: Much higher than filter-type because of high-gain, narrow-band IF amplifier.

E. Sweep Generator (Wobbly Scope)

  • Detailed Note: A sweep-frequency generator whose output frequency is linearly swept (wobbled) by a low-frequency sawtooth (e.g., 50 Hz). This output drives the horizontal (X) input of an oscilloscope. The vertical (Y) input is the output of the DUT (Device Under Test) being tested.

  • Application: Displays the frequency response (gain vs. frequency) of an amplifier, filter, or any network directly on the oscilloscope screen (X-axis = frequency, Y-axis = amplitude).

F. Thermocouple (Detailed)

  • Seebeck Effect: In a circuit of two dissimilar metals (A and B), if the two junctions are at temperatures $$\displaystyle T_1 $$ and $$\displaystyle T_2 $$, the net EMF is:

$$E_{AB}(T_1, T_2) = \int_{T_1}^{T_2} (S_A - S_B) dT$$

Where $$\displaystyle S_A, S_B $$ are Seebeck coefficients (material-dependent).
  • Materials: Reference junction often uses Constantan (copper-nickel alloy) paired with various metals (Iron, Copper, Chromel). Measuring junction uses Chromel-Alumel (Type K) for wide range and durability.

  • Cold Junction Compensation (CJC): Since tables give $E$ vs. $T$ for $$\displaystyle T_{ref}=0°C $$, if $$\displaystyle T_{ref} \neq 0°C $$, an equal and opposite EMF must be added. Done electronically by measuring $$\displaystyle T_{ref} $$ with an RTD/thermistor and adding a compensating voltage.

G. Hall Effect Transducer (Detailed)

  • Hall Voltage Derivation:

    Consider a thin slab of material (thickness $t$, width $w$, length $l$) with current $I$ along length ($x$), magnetic field $B$ perpendicular (z-direction).

    Lorentz force on charge carriers: $$\displaystyle F_L = q(v_d \times B) $$, deflects them to sides, creating transverse electric field $$\displaystyle E_H $$.

    At equilibrium: $$\displaystyle q E_H = q v_d B $$ → $$\displaystyle E_H = v_d B $$.

    Current density $$\displaystyle J = n e v_d = I / (w t) $$ → $$\displaystyle v_d = I / (n e w t) $$.

    Therefore, $$\displaystyle V_H = E_H \cdot w = \frac{I B}{n e t} = \frac{R_H I B}{t} $$.

  • Geometrical Correction Factor (k): For a rectangular sample, the exact Hall voltage is $$\displaystyle V_H = k \frac{IB}{n e t} $$, where $k$ depends on the aspect ratio ($w/l$). For $$\displaystyle w >> l $$, $k \approx 1$. For $$\displaystyle w = l $$, $k \approx 0.8$. This factor must be accounted for in precise measurements.


END OF UNIT 1 NOTES

Go to where you left off?

Quick Add to Notes

Save questions, your own notes and screenshots into notes filed by unit. It takes a free account.

Create free account

Have an account? Log in